Growing teamwork and leadership through bonding day

By Prithikkashinie Vaithiesvaran

Engineering Campus, 3rd April 2024 - Bonding day is a good way to build your community or strengthen the bond within a society. The Institution of Engineering and Technology (IET) of Universiti Sains Malaysia (USM) was able to do so by organizing a bonding day activity at the School of Electrical and Electronic Engineering. 

According to the project director, Najiha Maisarah Ahmad Desa, Electrical and Electronic Engineering 3, the  IET Bonding Day 2024 was held to strengthen the relationship between the IET USM committee members and have a better understanding of the society’s activities and one another.

“As the vice president of IET USM, I am happy about the turnout of the event. However, I believe there is room for improvement”, Najiha said.

She also added that they reached the target audience of 20 people which consisted of the high committee and committee members of IET USM.

“It took a month for us to plan this event and although everyone completed the tasks assigned to them on time, there were hurdles which caused me to constantly ask for updates from the organizing committee”, she said.

She also mentioned that she chose the location after discussing it with the organizing committee which consisted of 7 people, as it was easily accessible.

“I think this event was a success because the committee was able to widen their knowledge regarding the workflow and organisation culture” Najiha added.

An exco from the Logistics and Technical department, Prem Chandran, Electrical and Electronic Engineering 1, mentioned that he has a rough idea of how to handle the programs and has also finally met the committee members as the meetings before this were held online.

The committee members of IET-USM. Photo by IET-USM